发明名称 |
Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
摘要 |
A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.
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申请公布号 |
US7014093(B2) |
申请公布日期 |
2006.03.21 |
申请号 |
US20030607738 |
申请日期 |
2003.06.26 |
申请人 |
INTEL CORPORATION |
发明人 |
HOULE SABINA J.;DANI ASHAY A. |
分类号 |
B23K31/02;B23K1/00;B23K35/14;H01L23/373;H01L23/433 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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