发明名称 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
摘要 A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.
申请公布号 US7014093(B2) 申请公布日期 2006.03.21
申请号 US20030607738 申请日期 2003.06.26
申请人 INTEL CORPORATION 发明人 HOULE SABINA J.;DANI ASHAY A.
分类号 B23K31/02;B23K1/00;B23K35/14;H01L23/373;H01L23/433 主分类号 B23K31/02
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