| 摘要 |
A method of forming high resolution electronic circuits ( 10 ) on a substrate ( 12 ) is provided. The method includes the steps of laminating a dielectric layer ( 14 ) on a substrate ( 12 ), laser drilling channels ( 16 and 18 ) in the dielectric film ( 14 ) and the substrate ( 12 ), and filling channels ( 16 and 18 ) with a filler material ( 20 ). Further, a release layer ( 22 ) is applied to dielectric film layer ( 14 ) and filler material ( 20 ), the release layer ( 22 ) having an adhesive thereon. Release layer ( 22 ) is peeled or otherwise removed from substrate ( 12 ), leaving filler material ( 20 ) formed and shaped on substrate ( 12 ), thus producing a high resolution electronic circuit on substrate ( 12 ).
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