发明名称 |
System featuring a master device, a buffer device and a plurality of integrated circuit memory devices |
摘要 |
A memory system architecture/interconnect topology that includes at least one point-to-point link between a master, and at least one memory subsystem. The memory subsystem includes a buffer device coupled to a plurality of memory devices. The memory system may be upgraded through dedicated point-to-point links and corresponding memory subsystems. The master communicates to the plurality of memory devices in each memory subsystem through the respective buffer device via each point-to-point link.
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申请公布号 |
US7017002(B2) |
申请公布日期 |
2006.03.21 |
申请号 |
US20040952610 |
申请日期 |
2004.09.28 |
申请人 |
RAMBUS, INC. |
发明人 |
PEREGO RICHARD E.;SIDIROPOULOS STEFANOS;TSERN ELY |
分类号 |
G06F12/00;G06F13/16;G11C5/00;G11C7/10;G11C29/02 |
主分类号 |
G06F12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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