发明名称 Multilayer ceramic electronic component manufacturing method including a sintered adhesive layer with a resin and inorganic powder
摘要 A first step of alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body, and a second step of sintering the laminated body are provided. The adhesive layer includes a thermoplastic resin and at least one of Cr, Mg, Al, Si, a Cr compound, an Mg compound, an Al compound, an Si compound and an inorganic powder included in the ceramic sheet. This manufacturing method improves adhesion between a ceramic layer and the internal electrode after sintering and suppresses a structural defect such as delamination or a crack.
申请公布号 US7014725(B2) 申请公布日期 2006.03.21
申请号 US20030470099 申请日期 2003.07.25
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NAGAI ATSUO;OTSUKI JUN;KURAMITSU HIDEKI;KOBAYASHI KEIJI
分类号 C03B29/00;H01G4/30 主分类号 C03B29/00
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