| 摘要 |
In a method for molding module electronic devices, an outer edge portion ( 24 a') of each of plural terminals ( 24 ) arranged on a base board ( 23 ) is subjected to press-deformation processing by a curved portion ( 30 R) of an upper mold ( 30 ) to be shaped into a curved outer end portion ( 24 a) when the upper mold ( 30 ) is caused to be in contact with a lower mold ( 31 ) for forming a molding space between the upper and lower molds ( 30:31 ) in which the base board ( 23 ) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion ( 30 R) of the upper mold ( 30 ) is in tight contact with the curved outer end portion ( 24 a) of each of plural terminals ( 24 ), and finally the upper and lower molds ( 30;31 ) are separated from each other after the dissolved resin ( 36 ) in the molding space has solidified so that a module electronic device provided with the base board ( 23 ) on which the plural terminals ( 24 ) each having the curved outer end portion ( 24 a) and a resin-molded portion ( 21;22 ) which covers the base board ( 23 ) with the terminals ( 24 ) exposed to the outside is obtained.
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