| 摘要 |
A light-emitting microelectronic package includes a light-emitting diode ( 110 ) having a first region ( 114 ) of a first conductivity type, a second region ( 116 ) of a second conductivity type, and a light-emitting p-n junction ( 118 ) between the first and second regions. The light-emitting diode defines a lower contact surface ( 120 ) and a mesa ( 122 ) projecting upwardly from the lower contact surface. The first region ( 114 ) of a first conductivity type is disposed in the mesa ( 122 ) and defines a top surface of the mesa, and the second region ( 116 ) of a second conductivity type defines the lower contact surface that substantially surrounds the mesa ( 122 ). The mesa includes at least one sidewall ( 130 ) extending between the top surface ( 124 ) of the mesa and the lower contact surface ( 120 ), the at least one sidewall ( 130 ) having a roughened surface for optimizing light extraction from the package.
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