| 摘要 |
In a printed wiring board, a plurality of stacked innerlayer panels 100, 200, 300 have capacitors 105, 205, 305 connected in parallel by connecting a first electrode 110 of a first panel with a first electrode 210 of a second panel, and similarly connecting second electrodes 120, 220 of the first and second panels. The innerlayer panel having capacitors connected in parallel provides a high capacitance in a small x-y area. An alternative printed wiring board has a capacitor having a first foil electrode 101, and second and third electrodes located on opposite sides of the first foil electrode. Yet another printed wiring board has capacitors formed as an array of discrete foil electrodes spaced from an array of discrete printed electrodes. Forming discrete interconnected electrodes allows the electrodes to be fired without excessive thermal coefficient of expansion stresses damaging the electrodes. |
