发明名称 |
Manufacturing method of ball grid array package |
摘要 |
A manufacturing method of a ball grid array package mainly comprises providing a carrier unit with an upper surface and a lower surface, mounting a plurality of solder balls on the lower surface of the carrier unit, disposing a protective layer below the lower surface to cover the solder balls, placing a chip on the upper surface of the carrier unit and electrically connecting the carrier and the chip, encapsulating the chip and removing the protective layer so as to form said ball grid array package.
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申请公布号 |
US7015065(B2) |
申请公布日期 |
2006.03.21 |
申请号 |
US20040876452 |
申请日期 |
2004.06.28 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
TSAI YU-FANG;KANG JUNG-KUN;TSAI TSUNG YUEH |
分类号 |
H01L21/44;H01L21/48;H01L21/68;H01L23/31;H01L23/49;H01L23/498;H05K3/28;H05K3/34 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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