| 发明名称 |
CHEMICAL MECHANICAL POLISHING COMPOSITIONS FOR STEP-II COPPER LINER AND OTHER ASSOCIATED MATERIALS AND METHOD OF USING SAME |
| 摘要 |
A CMP composition and process for planarization of a semiconductor wafer surface having a copper barrier layer portion, said composition comprising an oxidizing agent, a boric acid component, and an abrasive.
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| 申请公布号 |
KR20060024775(A) |
申请公布日期 |
2006.03.17 |
| 申请号 |
KR20057021585 |
申请日期 |
2005.11.11 |
| 申请人 |
ADVANCED TECHNOLOGY MATERIALS INC. |
发明人 |
WRSCHKA PETER;BERNHARD DAVID;BOGGS KARL;DARSILLO MICHAEL |
| 分类号 |
C09G1/02;H01L21/321 |
主分类号 |
C09G1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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