发明名称 Menetelmä elektroniikkamoduulin valmistamiseksi
摘要 Method for manufacturing an electronic module, which electronic module includes a component (6), which has contact areas (17), which are connected electrically to a conductor-pattern layer (14). The manufacture according to the method starts from a layered membrane, which comprises at least a conductor layer (4) and an insulator layer (10) on the first surface of the conductor layer (4). Contact openings (17), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6), and which penetrate both the conductor layer (4) and the insulator layer (10), are made in the membrane. After the manufacture of the contact openings (17), the component (6) is attached to the surface of the insulator layer (10), in such a way that the contact areas (7) of the component (6) line up next to the contact openings (17). After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made, which connects the component (6) to the conductor layer (4) and the conductor layer (4) is patterned to form a conductor-pattern layer (14).
申请公布号 FI20041524(A) 申请公布日期 2006.03.17
申请号 FI20040001524 申请日期 2004.11.26
申请人 IMBERA ELECTRONICS OY, 发明人 TUOMINEN,RISTO;IIHOLA,ANTTI
分类号 H05K1/11;H01L;H01L21/48;H01L21/60;H01L21/68;H01L23/498;H01L23/538;H05K1/18;H05K3/32;H05K3/42 主分类号 H05K1/11
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