| 摘要 |
PURPOSE: A circuit for monitoring a state of a wire bonding is provided to increase the quality and reliability of an integrated circuit device, by more precisely monitoring the state of the wire bonding. CONSTITUTION: A circuit for monitoring a state of a wire bonding comprises: an applied voltage supplying element(1); a switching element(2); and a signal detecting element(3). The applied voltage-supplying element outputs a positive or negative applied voltage according to a polarity selection signal from a controller. The switching element, connected between wire for bonding and an output terminal of the applied voltage supplying element, applies the applied voltage from the applied voltage supplying element to the wire, according to an enable signal from the controller. The signal-detecting element generates each monitoring signal according to the applied voltage that changes during the time to bond a die pad(7) and a lead(12), outputs the monitoring signal to the controller. |
