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发明名称
封闭用环氧树脂成形材料及电子零件装置
摘要
本发明系有关含有(A)环氧树脂、(B)硬化剂、(C)氢氧化镁,且(C)氢氧化镁为被二氧化矽所被覆之封闭用环氧树脂成形材料者。藉此可在不含卤素并在不含锑之情形下,得到难燃性、成形性、耐逆流性、耐湿性及高温放置性等之信赖性极优,且极适于VLSI封闭用之封闭用环氧树脂成形材料及具备以此成形材料封闭之元件的电子零件装置。
申请公布号
TW200610106
申请公布日期
2006.03.16
申请号
TW094123779
申请日期
2005.07.13
申请人
日立化成工业股份有限公司
发明人
池泽良一;吉泽秀崇;赤城清一
分类号
H01L23/00;C08G59/00;C08L63/00
主分类号
H01L23/00
代理机构
代理人
林志刚
主权项
地址
日本
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