| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize moreover an acceleration sensor chip package, and to provide its manufacturing technology. <P>SOLUTION: The acceleration sensor chip package 10 is equipped with frame section 13, a beam section 14a elongating into an aperture 16, a movable structural skeleton 15 containing a moving part 14b movably supported by the beam section, an acceleration sensor chip 11 having a detecting element 19 detecting displacement of this movable structural skeleton 15, a closed annular ring section 20, a lamellar member 30, jointed to the top face 20a of the ring section, sealing the movable structural skeleton from the top surface side of the aperture, a plurality of electrode pads 18 exposed from external domain 13a of the flame section, a re-wiring layer 17 having a plurality of wiring sections 17a, an external terminal 70 prepared on external domain, a sealing section 50 for sealing the ring section, the lamellar member, the electrode pads, and the re-wiring layer, and a substrate 12 contacting the lower surface of the acceleration chip to seal the aperture from lower surface side. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
