发明名称 FLEXIBLE WIRING SUBSTRATE AND FOLDING ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To solve a problem that, in a flexible wiring substrate including a jumper line, noise generated from one FPC for connecting a signal line can not be shielded only by connecting the signal lines of two circuit boards and a GND via separate FPCs, since it is extremely difficult occasionally to lay around the jumper line inside a hinge of folder type portable telephone in various shapes. SOLUTION: A flexible substrate 102 comprises a connector 103 which is connected with a connector of an upper substrate, and a connector 104 which is connected to a connector of a lower substrate at its both ends. A flexible substrate 201 includes a copper foil layer all over the surface, and comprises, at its both terminal portions, a coverlay opening 207 for connecting the copper foil layer to a metal shield or the like of the upper substrate, and a coverlay opening 208 for connecting the copper foil layer to a metal shield or the like of the lower substrate. These flexible substrates 102 and 201 are mutually adhered by double-coated tapes 209 and 210. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006073840(A) 申请公布日期 2006.03.16
申请号 JP20040256424 申请日期 2004.09.03
申请人 NEC CORP 发明人 OTANI TAKUMI
分类号 H05K1/14;H04M1/02;H05K1/02 主分类号 H05K1/14
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