| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a circuit board and a loaded circuit or the like are degraded thermally by the heat of a high temperature received when lead-free solder paste is melted, because the circuit board has been more thinned and complicated by the requirement of the thinning of the recent circuit board and an improvement in the function of the loaded circuit part. SOLUTION: The circuit board includes the circuit board (a printed board) 1 with first terminals (electrodes) 11 and 12, and the circuit 2 with second terminals (the electrodes) 22 and 23 electrically connected to the pads 11 and 12, respectively. The circuit board further includes conductive paste 3 electrically connecting the pads 11 and 12 and the leads 22 and 23, respectively, while fixing the circuit part 2 to the printed board 1. COPYRIGHT: (C)2006,JPO&NCIPI
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