| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet improved in handling properties, capable of preventing a falling resin powder from adhering thereto, and capable of producing a flexible printed-wiring board in a good yield. SOLUTION: This thermally curable adhesive sheet is formed by impregnating a fiber base material with an adhesive composition, wherein a cured material of the adhesive composition has an elastic modulus of 500-7,000 MPa and a mass ratio of an elastomer to an inorganic filler [elastomer/inorganic filler] contained in the composition is not less than 0.1 and less than 4.05. It is preferable that the adhesive composition contains (A) an epoxy resin, (B) a curing agent for the epoxy resin, (C) a curing accelerator, (D) the elastomer, and (E) the inorganic filler as essential components. COPYRIGHT: (C)2006,JPO&NCIPI
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