| 摘要 |
PURPOSE:To perform high integration, high density and high speed circuit in a layer of lower position in 3-dimensional IC having a photoelectric converter on the uppermost layer by providing an element having a drive capacity on the layer immediately lower from the converter. CONSTITUTION:In a 3-dimensional IC, the lowermost layer A is a memory, a layer B is a calculator, a layer C is a driver, and a layer D is a photoelectric converter. In this case, the layers A, B are designed for high density, high integration and high speed, and optimized in the process. On the other hand, the layer C is designed to have the maximum limit of the drive capacity, and the designing rule can be alleviated as compared with the layers B, A. On the other hand, the layer D converts the light input from the exterior into an electric signal, or converts an electric signal fed from the lower layer into a light. When the layer C is formed to alleviate the designing rule from the layers B, A, thereby strengthening the durability for the signal input from the exterior. |
