| 摘要 |
An object of the present invention is to minimize a fear of damaging parts when they are transferred from a carry-in cassette to a carry-out cassette and to shorten a transferring time. Tip end portions of a thrusting-down pin 30 and a suction collet 50 are brought into contact with a back face of an adhesive sheet 11 of a carry-in cassette 10 to thrust down a semiconductor chip 1 and the thrust-down semiconductor chip 1 is received on a carry-out cassette 20 A, 20 B, or 20 C and stuck on an adhesive sheet 21 A, 21 B, or 21 C of a receiving face 201 A, 201 B, or 201 C of the carry out cassette 20 A, 20 B, or 20 C.
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