发明名称 Method for producing bumps on an electrical component
摘要 A method for producing contacts in the form of bumps on a component that comprises a base body includes, first, positioning a template on the base body. Through holes are produced through the template. By filling the through holes with an electrically conductive material and subsequently hardening, fillers are produced. Bumps for the external electrical contact of the fillers are, then, produced directly on the surfaces of the fillers.
申请公布号 US2006057830(A1) 申请公布日期 2006.03.16
申请号 US20050252141 申请日期 2005.10.17
申请人 EPCOS AG 发明人 FEICHTINGER THOMAS;PUDMICH GUNTHER
分类号 H01L21/44;H01C1/144;H01C17/28;H01L21/48;H01L23/485;H01L23/498;H05K1/03;H05K1/11;H05K3/34;H05K3/40;H05K3/46 主分类号 H01L21/44
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