| 摘要 |
Packaging assembly method and systems include the use of a plastic substrate and one or more compliant fasteners, which can be connected to the plastic substrate, such that the compliant fastener provides an electrical connection to one or more electrical components. A plastic leadframe can therefore be formed, which is based upon the plastic substrate and the compliant fastener for attachment to other electrical components. The plastic substrate itself can function as a plastic trace or plastic substrate trace, and can be formed from plastic material such as thermoplastic or a thermoset material. The compliant fastener itself can be pushed into the plastic substrate at a connection point thereof for attachment of the compliant fastener to the plastic substrate. The connection point can be formed in the plastic substrate as one or more round holes, slots, rectangular holes or complex shapes. An interface is therefore for med between the plastic trace and the compliant fastener.
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