发明名称 PACKAGE MANUFACTURING APPARATUS, PACKAGE MANUFACTURING METHOD AND PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a package manufacturing apparatus for manufacturing a package which improves sealing performance at bundling parts, improves pressure-resistant strength, has soft end parts, and has no possibility of damaging a film of another package. <P>SOLUTION: The package manufacturing apparatus 1 is equipped with a squeezer for forming non-existing parts of a content to be flat by specified intervals in the longitudinal direction of a cylindrical film filled with the content, a bundling device for bundling the non-existing parts in the direction of crossing the flat faces, a tape feeding device for feeding a tape to a first face along the bundled non-existing parts, a tape feeding device for feeding the tape to a second face pinching the non-existing parts between it and the first face, a first sealing device for performing a first seal in the direction of crossing the non-existing parts bundled with two sheets of the tapes, a second sealing device for performing a second seal of the two sheets of the tapes in the direction of intersecting the first seal, and the third sealing device for performing a third seal of the two sheets of the tapes in the direction of intersecting the first seal on the opposite side pinching the bundled non-existing parts to the second seal. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006069648(A) 申请公布日期 2006.03.16
申请号 JP20040257342 申请日期 2004.09.03
申请人 KUREHA CORP 发明人 MIDORIKAWA KOJI;ABE TOSHIHIRO;SEYA KIYOMI
分类号 B65B51/08;B65B9/12;B65B51/10;B65D75/46;B65D75/52 主分类号 B65B51/08
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