| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a size and weight of a power supply distribution apparatus mounted in a vehicle. <P>SOLUTION: The power supply distribution apparatus includes: multiple bus bars 12A, 12B and 12C that are arranged in substantially the same plane and constitute an electric circuit; and insulating plates 11 laminated over these bus bars 12A, 12B and 12C. It selectively distributes vehicle power supply to multiple loads. A semiconductor chip 20 is mounted directly on the bus bar 12C, and the bus bars 12A and 12B adjacent to the bus bar 12C and the semiconductor chip 20 are connected with each other through bonding wires 21 and 22. The semiconductor chip 20, the bus bar 12C mounted with the semiconductor chip 20, the bonding wires 21 and 22, and the adjacent bus bars 12A and 12B are molded with resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
