| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for preventing device destruction chips from being generated even in a semiconductor device formed with a device destruction layer, and for preventing a flexible portion from being damaged even in the semiconductor device formed with the flexible portion. SOLUTION: In this semiconductor device holder comprising a collet for adsorbing and holding a semiconductor device by negative pressure, a projecting wire is provided on the holding side of the collet, a holding plane is formed by confronting openings of a plurality of sucking holes formed in the projecting wire to the semiconductor device, and the front side of the semiconductor device is adsorbed by the holding plane. COPYRIGHT: (C)2006,JPO&NCIPI |
