| 摘要 |
PROBLEM TO BE SOLVED: To solve problem such as low production efficiency for long time required for conventional heating joint or anode joint at glass-Si joint, or device fault such as warping for thermal expansion. SOLUTION: After applying surface activation to joint surface of the joint objects by atomic beams, ion beams or energy waves (plasma), this solution separates the device to be temporarily joined at normal temperature from a device to be joined completely by heating and lines up multiple joint devices. In addition, this solution temporarily joins two glasses at both sides of devices to be encapsulated from both sides and then joins them by heating without warping. COPYRIGHT: (C)2006,JPO&NCIPI
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