发明名称 TWO LAYER FLEXIBLE BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a two layer flexible board which is superior in adhesiveness of an insulator film and a ground metal layer and corrosion resistance, and in which a copper coat layer having high insulation reliability is formed without missing of copper coat part due to a pin hole which occurs, when the ground metal layer is formed. SOLUTION: In the two layer flexible board, the ground metal layer with a film thickness of 3 to 50 nm, which mainly contains nickel-titanium-chromium alloy where a rate of titanium is 3 to 22 weight%, a ratio of chromium is 5 to 22 weight% and remaining part being nickel is formed on at least one face of the insulator film by a dry plating method without through adhesive, and the copper coat layer is formed on the ground metal layer by the dry plating method. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006073766(A) 申请公布日期 2006.03.16
申请号 JP20040254943 申请日期 2004.09.01
申请人 SUMITOMO METAL MINING CO LTD 发明人 ASAKAWA YOSHIYUKI;NAGATA JUNICHI
分类号 H05K1/09;C23C14/14;C23C18/16;C23C18/40;C23C28/00;H05K3/00 主分类号 H05K1/09
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