发明名称 ETCHING EQUIPMENT AND ETCHING SYSTEM
摘要 PROBLEM TO BE SOLVED: To improve economy and reduce an exhaust amount of gas to prevent environmental destruction by making effective use of a fluorine stable gas at the time of plasma-etching a workpiece. SOLUTION: The etching equipment comprises an etching section 52 wherein the workpiece is stored and the fluorine stable gas is turned into plasma and then the workpiece is etched with the plasma; a gas supply section 51 for supplying the fluorine stable gas into the etching section 52; and a gas exhaust section 70 for exhausting used gas out of the etching section 52. In the etching equipment, a gas collecting section 80 for collecting a remainder of the fluorine stable gas which has not been used for etching is connected to the gas exhaust section 70. The collected gas is supplied to the gas supply section 51 by a recycling section 90 to be reused. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006073592(A) 申请公布日期 2006.03.16
申请号 JP20040251975 申请日期 2004.08.31
申请人 DISCO ABRASIVE SYST LTD 发明人 KAWAI AKIHITO;FUJISAWA SHINICHI
分类号 H01L21/3065;H01L21/304 主分类号 H01L21/3065
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