发明名称 PRINT SOLDER INSPECTION SYSTEM
摘要 PROBLEM TO BE SOLVED: To recognize distribution or trend at a quantitative glance of the difference of solder state printed on layout of a print substrate relative to a reference data. SOLUTION: A difference arithmetic operation means 9 determines differences of heights, areas and volumes of print solder showing a state of the measured print solder to a pre-memorized reference as the deviation values, a gradation partitioning means 10 expresses the deviation values using expressive gradation and is constructed to recognize distribution states by giving gradation by gradation intensity levels for each print solder part and to express concurrently a gradation scale used as a target for extent of the deviation values to the gradation intensity level. Moreover, in order to recognize a whole trend from a macroscopic view point, a construction to express average values at a gradation intensity levels is provided by averaging deviation values for each domain after dividing the layout to a plurality of domains. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006071416(A) 申请公布日期 2006.03.16
申请号 JP20040254315 申请日期 2004.09.01
申请人 ANRITSU CORP 发明人 KIMURA TAKESHI;TAKADA OSAMU;SUZUKI KATSUYUKI
分类号 G01B11/02;G01B11/00;G01B11/28;G01N21/956;H05K3/34 主分类号 G01B11/02
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