| 摘要 |
A bonding wire ( 1 ) includes a matrix material ( 2 ) and a filler ( 3 ) embedded in this matrix material ( 2 ), the coefficient of thermal expansion of the filler ( 3 ) being lower than the coefficient of thermal expansion of the matrix material ( 2 ), and the filler ( 3 ) content by weight amounting to at least 25% of the weight of the bonding wire ( 1 ). Also, a bonded connection between a bonding wire and a substrate is described.
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