发明名称 |
Heat sink |
摘要 |
A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
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申请公布号 |
US2006054307(A1) |
申请公布日期 |
2006.03.16 |
申请号 |
US20050221285 |
申请日期 |
2005.09.07 |
申请人 |
FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
LEE HSIEH-KUN;CHEN CHUN-CHI;ZHOU SHI-WEN;FU MENG |
分类号 |
H05K7/20;H01L23/34;H01L23/427;H01L23/467 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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