Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

摘要

A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.