发明名称 Multi-chip semiconductor packages and methods of operating the same
摘要 Integrated circuit devices are provided including first and second chips and a common input/output pad electrically coupled to the first and second chips. At least one of the first and second chips includes a high voltage generator configured to receive an input voltage through the common input/output pad and generate a test voltage responsive to a test mode signal during a test mode of operation. The test voltage is higher than the input voltage. Related methods of operating integrated circuit devices and semiconductor devices are also provided.
申请公布号 US2006056248(A1) 申请公布日期 2006.03.16
申请号 US20040001343 申请日期 2004.12.01
申请人 发明人 HAN SANG-JIB;LEE CHANG-HWAN
分类号 G11C7/00 主分类号 G11C7/00
代理机构 代理人
主权项
地址