COATING/DEVELOPING APPARATUS, EXPOSURE APPARATUS AND RESIST PATTERN FORMING METHOD

摘要

A coating/developing apparatus is provided with a space saving cleaning unit for removing a water shedding protection film used for shedding particles adhered on the periphery of a semiconductor wafer after immersion exposure and prior to development and/or for shedding a liquid during the immersion exposure. The cleaning unit is arranged in an interface block of the coating/developing apparatus. A nozzle unit moves and the periphery of the wafer held by a wafer holding member is surrounded by an angled-bracket-shaped surrounding part of the nozzle unit. A cleaning solution is ejected to the periphery of a front plane and a rear plane of the wafer from an upper side nozzle part and a lower side nozzle part provided on an upper part and a lower part of the surrounding part, respectively, and at the same time, the cleaning solution is sucked from a suction port on a side part of the surrounding part.