| 摘要 |
<p>A surface acoustic wave element (2) is mounted onto a mounting substrate (1/41) having a terminal electrode (7) via a bump (3) by flip chip bonding. The surface acoustic wave element (2) is covered with a resin film (10). The periphery of the surface acoustic wave element (2) mounted on the mounting substrate (1/41) is covered with a part of the resin film (10) so that the surface acoustic wave element (2) is sealed. The resin film (10) is hardened. Thus, a surface acoustic wave device is provided.</p> |
