<p num="1"><br/><br/><br/>Encapsulated cure systems are provided wherein a curative is incorporated into <br/>a solid or semi-solid carrier material whereby mere fracturing or failure of <br/>the capsule wall encapsulating such cure systems will not provide for or allow <br/>sufficient release of the curative. Also provided are adhesive systems <br/>incorporating said encapsulated cure systems.<br/></p>
申请公布号
CA2578694(A1)
申请公布日期
2006.03.16
申请号
CA20052578694
申请日期
2005.08.31
申请人
APPLETON PAPERS INC.
发明人
SCHWANTES, TODD ARLIN;KRZOSKA, MICHAEL CURLEY;KULIBERT, GREGORY STEPHEN;MALOFSKY, BERNARD MILES;WARD, NAGIB MAURICE;MALOFSKY, ADAM GREGG