| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator which is miniaturized and made thin and has increased bonding strength, and a method of manufacturing the same. <P>SOLUTION: A piezoelectric oscillator 10 is composed of a piezoelectric vibration element 12 with a built-in piezoelectric vibrator and an electronic component 14. In the electronic component 14, the active face of an electronic component body 20 is covered with sealing resin 34. In the electronic component 14, a terminal portion of the electronic component body 20 and a pad of an insulating substrate 22 are connected by a bonding wire 30a. The bonding wire 30b is partially exposed to the surface of the sealing resin 34. On the surface of the sealing resin 34, an electrode pattern 36 is provided in the area including the exposed portion of the bonding wire 30b. An external terminal formed on a lower surface of the piezoelectric vibration element 12 is bonded to the electrode pattern 36. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
