| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved lead frame by which a wire bonding property of an internal lead and a soldering affinity of an external lead are progressed, and to provide a method of manufacturing the lead frame. <P>SOLUTION: This invention relates to the lead frame provided with: a plurality of internal leads mutually formed at a predetermined interval; and a plurality of external leads each extending in the longitudinal direction of the internal lead, one end portion thereof being combined with the internal lead in the overlapping state and the other end portion thereof being interconnected by a supporting portion, and the method of manufacturing the lead frame. Thereby, the wire bonding property of the internal lead and the soldering affinity of the external lead are progressed, and a failure of a product is prevented although a product yield improves. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
