摘要 |
PROBLEM TO BE SOLVED: To decrease the electrostatic capacity between a gate and a drain and decrease the on-state resistance and the gate resistance of a MOS gate device die. SOLUTION: This device having a drain electrode on a die top surface and a source electrode on a die bottom front surface acts on control voltage connected between a drain region and a gate region. A device cell has a main body short trench and a gate trench. Gate polycrystalline is arranged on a gate trench bottom and is arranged adjacently to thin gate oxide for lining a channel region by the overlap of a minimum drain drift region. A main body short trench bottom comprises a contact for shunting a main body region to the channel region. A main body short surface drain region and gate polysilicon are simultaneously silicided. The gate trench is expanded on the top surface in order to improve the property of Q<SB>gd</SB>. The main body short trench and the gate trench are simultaneously filled up with a gap filling material. COPYRIGHT: (C)2006,JPO&NCIPI
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