发明名称 TOP SURFACE DRAIN MOS GATE DEVICE AND METHOD FOR MANUFACTURING IT
摘要 PROBLEM TO BE SOLVED: To decrease the electrostatic capacity between a gate and a drain and decrease the on-state resistance and the gate resistance of a MOS gate device die. SOLUTION: This device having a drain electrode on a die top surface and a source electrode on a die bottom front surface acts on control voltage connected between a drain region and a gate region. A device cell has a main body short trench and a gate trench. Gate polycrystalline is arranged on a gate trench bottom and is arranged adjacently to thin gate oxide for lining a channel region by the overlap of a minimum drain drift region. A main body short trench bottom comprises a contact for shunting a main body region to the channel region. A main body short surface drain region and gate polysilicon are simultaneously silicided. The gate trench is expanded on the top surface in order to improve the property of Q<SB>gd</SB>. The main body short trench and the gate trench are simultaneously filled up with a gap filling material. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006074054(A) 申请公布日期 2006.03.16
申请号 JP20050255650 申请日期 2005.09.02
申请人 INTERNATL RECTIFIER CORP 发明人 KINZER DANIEL M;JONES DAVID P;SPRING KYLE
分类号 H01L29/78 主分类号 H01L29/78
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