MANUFACTURING METHOD AND APPARATUS OF ELECTRONIC COMPONENT SEALING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component sealing structure capable of being sealed in a high vacuum state by preventing gas from being encapsulated into the electronic component sealing structure.

SOLUTION: The manufacturing method of an electronic component sealing structure comprises steps of accommodating a quartz oscillator in a container (step S1); disposing a cover on the opening peripheral edge of the container and tentatively fixing them (step S2); thereafter irradiating the region of the cover excepting the predetermined region of the outer periphery of the cover with an electron beam and forming a non-welded portion in the predetermined region (primary welding process step S3); thereafter heating a package at a predetermined temperature and annealing it (annealing process step S4), and further cooling the same to a predetermined temperature (cooling process step S5); and irradiating the non-welded portion with a laser beam to completely seal the package (secondary welding process step S6).

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