| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, having a structure which is high in reliability and can be manufactured efficiently. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 10 having pads 21, 22 of a first and a second groups, and a wiring board 30 having leads 41, 42 of a first and a second groups. The pad 21 is arranged along a first straight line 110, and the pad 22 is arranged along a second straight line 120, extending in parallel with respect to the first straight line 110. The leads 41, 42 have joints 44, 45, bending portions 46, 47, and base edges 48, 49, respectively. The pad 21 faces the joint 44, and the pad 22 faces the joint 45, respectively. The joint 44 is formed in a profile extending along a straight line 310 passing a first point 210, and the joint 45 is formed in a profile extending along a straight line 320 passing a second point 220, respectively. The leads 41, 42 are formed, in such a manner that they are pulled out from the side 12 of the semiconductor chip 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
