| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device used by connecting a plurality of circuit blocks and which is also suitable as a high-frequency module. <P>SOLUTION: A four-layered flex/rigid substrate 10 includes a flexible wiring 15 substantially at the center, an electromagnetic shielding layer 14b-1 on a lowermost layer of a region BL1, and a grid land 14b-2 on the lowermost layer of a region BL2. There are provided a first circuit block that forms a high-frequency signal processing circuit, by mounting electronic components 21a to 21e on the region BL1 of the substrate, and a second circuit block that forms an intermediate-frequency signal processing circuit by mounting electronic components 22a to 22c on the region BL2. Thereafter, sealing resin 23, to which electromagnetic shielding effect is given, is applied over the entire surface of the mounting surface of the electronic components 21a to 21e, 22a to 22c, and is then heated and hardened, such that a folded electromagnetic shielding layer is disposed on the upper surface of the flexible wiring 15 and the grid land on the lower surface of the same. Consequently, the circuit device is prevented from being affected by the interferences among electronic components and electromagnetic influence from the outside. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
