| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a semiconductor device which has a pad for solder connection from being peeled in film at the pad which is possibly caused by a thermal load etc., during a manufacturing process. <P>SOLUTION: A pad structure is formed by inserting a Cr film which has excellent adhesive strength with a Ti film formed on silicon or a silicone oxide film or a Ti compound film and an Ni film (or Cu film) where solder is connected. Further, the Cr film is formed having an area larger than the Ti or Ti compound film to prevent peeling caused at the interface between the both. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
