| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having a high degree of freedom of designing in the depthwise direction with respect to the front surface of the board as shown by having such portions as side faces of shield interconnections having a coaxial line structure and interlayer interconnections of a multilayer wiring board. SOLUTION: A metal is used for a core substrate. The core substrate is photo etched, and then an insulation resin is cast, and lamination is performed at least once, or twice or more, to form the side faces of shield interconnections having a coaxial line structure and interlayer interconnections of a multilayer wiring board. The coaxial line structure is such that a signal line is surrounded by an insulation resin layer and then the insulation resin layer is coated with an annular shield electrode. It is preferred that interlayer connection is performed between top and bottom faces of the shield electrode which is perpendicular to the signal line having the coaxial line structure. COPYRIGHT: (C)2006,JPO&NCIPI |
