| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic circuit or an optical member, which has a high-definition pattern with a uniform film thickness. <P>SOLUTION: This manufacturing method for the electronic circuit or the optical member, which has the high-definition pattern with the uniform film thickness, is characterized by comprising: a step of forming a photosensitive resin composition layer on a sheet-like or cylindrical substrate; a step of curing the formed photosensitive resin composition layer by irradiating it with light; a step of forming the pattern by using laser light; and a printing step of transferring ink, containing at least one kind selected from among an insulator, a semiconductor and a conductor, onto a base material to be printed, by using an obtained printing plate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
