| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer board in which a chip component is embedded in an insulating material, which suppresses a shift in the position of the chip component occurring at a manufacturing stage. <P>SOLUTION: By the manufacturing method for the multilayer board, first resin films 10b to 10d have through-holes hb to hd, respective, for inserting the chip components 2 therein, and second resin films 10a, 10e have no through-holes. The through hole hb of at least one second resin film 10b to be stacked is formed with a plurality of projections (t5, t6) whose front ends are opposed to each other across a gap (Wt) smaller than the outer dimension (W2) of the chip component 2. The chip component 2 is press-fitted into the through-hole hb while breaking tip of the projections (t5, t6) are crushed. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
