| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesive characteristic between a semiconductor device and a substrate by pasting the substrate with a penetrated part to the semiconductor device with an external connection terminal with an adhesive bond concerning the semiconductor device to which the external connection terminal and the substrate are connected, and to reduce a manufacturing cost. SOLUTION: A stud bump 75 is formed on the electrode pad 67 of a semiconductor device 65. When a paste-like adhesive bond 69 flows into the electrode pad 67 side, a portion 75A connected to a bonding wire 70 so that it may be exposed from the paste-like adhesive bond 69 by setting the height of the stud bump 75 for connecting the stud bump 75 and a bonding pad 59 by the bonding wire 70. COPYRIGHT: (C)2006,JPO&NCIPI
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