MOUNTING/DISMOUNTING METHOD OF SEMICONDUCTOR DEVICE, MOUNTING/DISMOUNTING DEVICE OF SEMICONDUCTOR DEVICE USING METHOD, AND SOCKET FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To avoid spring-up at the mounting time of a semiconductor device without requiring a complicated adjustment work. SOLUTION: A cover member 34 is raised in the state where the semiconductor device 26 wherein an adsorption pad 24 is arranged on a positioning member 44 is pressed, and thereby an electrode part 26a of the semiconductor device 26 is sandwiched by moving contacts 46M, 46F of a contact terminal 46ai. COPYRIGHT: (C)2006,JPO&NCIPI