| 摘要 |
Provided is a novel aqueous slurry composition for polishing/planarization of a substrate. The composition includes silicon dioxide abrasive particles wherein the abrasive particles are anionically modified/doped with metallate anions selected from the group consisting of aluminate, stannate, zincate and plumbate, thereby providing a high negative surface charge to the abrasive particles and enhances the stability of the slurry composition. |
