| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for controlling the contact load of an electronic-part mounting device capable of accurately controlling the actual contact load in a contact set load set in a low load, and capable of mounting an electronic part without the fear of a damage even in the electronic part using a low dielectric-constant substance. <P>SOLUTION: In a low-speed lowering operation process, a head is lowered and operated at a high speed up to a low-speed lowering-start place set at a place where the electronic part and a substrate are not brought into contact, and lowered and operated at a low speed until the specified contact set load is detected. The low-speed lowering operation process has a lowering operation process in which the head is lowered and operated by a specified quantity, a load detection process in which a current load is detected after the lowering operation, and a process in which whether or not the current load reaches the contact set load is decided. In the low-speed lowering operation process, the lowering operation process and the load detection process are repeated until the current load reaches the contact set load. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
