| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for removing a resin die formed by X-ray lithography with solvent efficiently and inexpensively without having any effect on a microstructure, and to fabricate the microstructure inexpensively by utilizing X-ray lithography. SOLUTION: The process for forming a resin die by X-ray lithography and forming a microstructure by the resin die comprises a step for removing the resin die thus formed, a step for irradiating the resin die with an electron beam, and a step for dissolving the irradiated resin die with solvent. The electron beam preferably has an absorbed dose of 10-500 kGy, and the resin die is preferably removed at 130°C or below. COPYRIGHT: (C)2006,JPO&NCIPI
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