| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film vapor deposition system with a simple constitution preferably usable for depositing a thin film with a uniform thickness on the surface of a large-sized substrate. SOLUTION: In the thin film vapor deposition system composed of a vacuum tank provided, at the inside, with a substrate holder capable of holding a substrate so as to rotate along the flat face of the substrate around the central position of the substrate and an evaporation source installation region set to the position opposite to the substrate holder, and depositing a thin film on the surface of the substrate by vapor deposition, long and slender one or more vapor deposition shielding boards having a length longer than the radius of the substrate are installed. Each vapor deposition shielding board can perform rotary movement or shake movement with a supporting point installed at the outside of the region to which the substrate is held as the center carried out in such a manner that the tip part thereof moves so as to cover the central position of the substrate by the supporting point at a prescribed period. COPYRIGHT: (C)2006,JPO&NCIPI
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